RH150
主營生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料：銅箔基板，提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。
所屬分類：
產(chǎn)品關(guān)鍵詞：
手機(jī)
電子產(chǎn)品
筆記本電腦
關(guān)鍵詞：
普通FR-4 | 半固化片 | 無鉛兼容FR-4 | 無鹵兼容FR-4
產(chǎn)品描述
電子資訊工業(yè)近幾年來在中國的迅速發(fā)展下，結(jié)合各種相關(guān)產(chǎn)業(yè)，已經(jīng)成為中國蓬勃發(fā)展、舉足輕重的新興產(chǎn)業(yè)。
江蘇諾德正是藉此信息產(chǎn)業(yè)化發(fā)展之平臺，以專業(yè)制造電子基礎(chǔ)材料為優(yōu)勢，于2007年開始建立銅箔基板生產(chǎn)基地，憑借優(yōu)秀的科技人才與創(chuàng)新的研發(fā)能力，配套發(fā)展生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料：銅箔基板，提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。
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RH150 |
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(UL ANSI:FR-4.1)High Performance，Mid-Tg Halogen-free |
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特點(diǎn)
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應(yīng)用領(lǐng)域 |
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FEATURES
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APPLICATIONS |
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GENERAL PROPERTIES |
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Test Item |
Test condition |
Units |
Standard value |
Typical value |
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1.Peel Strength , IBS/IN,Minimum,1 OZ |
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IBS/IN |
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As received |
A |
≥8.0 |
10.8 |
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After thermal stress |
A |
≥8.0 |
10.8 |
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2. Volume resistivity ,Minimum |
E-24/125 |
MΩ.cm |
≥103 |
≥107 |
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3. Surface resistivity , Minimum |
E-24/125 |
MΩ |
≥103 |
≥107 |
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4.Water absorption , Maximum |
E-1/105+des |
% |
≤0.50 |
0.15 |
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5.Dielectric Breakdown, Minimum |
D-48/50 D-0.5/23 |
Kv |
≥40 |
43 |
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6. Flexural strength ,Minimum |
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Mpa |
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Length direction |
A |
≥415 |
580 |
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Cross direction |
A |
≥345 |
460 |
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7.Arc resistance ,Minimum |
D-48/50 |
S |
≥60 |
160 |
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8.Flammability |
A |
S |
UL-94V0 |
UL-94V0 |
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9. Permittivity 1MHZ ,Maximum |
A |
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≤5.4 |
4.8 |
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10.Loss tangent 1MHZ ,Maximum |
A |
--- |
≤0.035 |
0.011 |
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11.Thermal stress 288℃,10sec( Minimum ) |
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--- |
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Non etched specimen |
A |
NO DEFECT |
NO DEFECT |
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Etched |
A |
NO DEFECT |
NO DEFECT |
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12. TG(DSC,℃) |
A |
℃ |
≥150 |
152 |
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13.CTE(Z-axis) |
Before Tg |
PPM/℃ |
≤60 |
45 |
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After Tg |
PPM/℃ |
≤300 |
240 |
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50-260℃ |
% |
≤3.5 |
2.9 |
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14.T260 |
TMA |
min |
≥30 |
60 |
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Note: |
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Warpage of Warpage of
(No-treating) (After treating:125℃ 2hr)
Peel strength
※Specimen T hickness:1.6mm single side board
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PURCHASING INFORMATION |
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Thickness |
Copper foil |
Standard Size |
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0.2mm to 3.4mm |
12μm to 105μm |
1041×1245mm（41″×49″） 940×1245mm（37″×49″） |
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※ Other sheet size and thickness could be available upon request. |
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Cooperation Intent Form
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